Qué (quién) es Small Outline J - definición
TYPE OF SURFACE MOUNT IC PACKAGE
Thin small-outline package; Thin Small Outline Package
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![TSOP type I: [[Atmel]] AT29C010A](https://commons.wikimedia.org/wiki/Special:FilePath/IBM PCMCIA Data-Fax Modem V.34 FRU 42H4326 - Atmel AT29C010A-9352.jpg?width=200 "TSOP type I: [[Atmel]] AT29C010A")
Small-outline transistor
FAMILY OF DISCRETE SURFACE MOUNT TRANSISTORS
SOT-23; Small Outline Transistor; Small outline transistor
A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations, link from amkor.
Thin shrink small outline package
IC PACKAGE TYPE
Thin Shrink Small Outline Package; TSSOP; Htssop
The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.
small intestine
![[[Micrograph]] of the small intestine [[mucosa]] showing the [[intestinal villi]] and [[crypts of Lieberkühn]].](https://commons.wikimedia.org/wiki/Special:FilePath/Small intestine low mag.jpg?width=200 "[[Micrograph]] of the small intestine [[mucosa]] showing the [[intestinal villi]] and [[crypts of Lieberkühn]].")
![Fig 400]]](https://commons.wikimedia.org/wiki/Special:FilePath/Sobo 1906 401.png?width=200 "Fig 400]]")
![Small intestine [[in situ]], greater omentum folded upwards.](https://commons.wikimedia.org/wiki/Special:FilePath/Sobo 1906 408.png?width=200 "Small intestine [[in situ]], greater omentum folded upwards.")
.jpg?width=200 "Tissue layers (mucosa, submucosa & muscularis)")
PART OF THE DIGESTIVE TRACT, FOLLOWING THE STOMACH AND FOLLOWED BY THE LARGE INTESTINE FAKE
Small bowel; Small Intestine; Small intestinal; Small intestines; Intestine, small; Unstirred water layer; Intestinum tenue; Absorption (small intestine)
¦ noun the part of the intestine that runs between the stomach and the large intestine, consisting of the duodenum, the jejunum, and the ileum.
Wikipedia
Thin small outline package
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Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).
They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications.
TSOP is the smallest leaded form factor for flash memory.
